Stanyl® TS250F6D

30% Glass Reinforced, Flame Retardant, Heat Stabilized, Improved resistance to blistering during reflow - soldering process

Back to results

General Information

Stanyl® is our high-performance polyamide 46 used for applications in automotive, E&E, gears and outdoor power equipments.
Stanyl® is a high performance polyamide that provides unmatched performance and value for demanding applications in which superior heat resistance, design stiffness, wear & friction and process flow qualities are required.
Because Stanyl retains its mechanical properties at high temperatures up to 220°C, this makes it ideal for extremely high-performance applications, where it outperforms PPA, PA6T, PA9T, and often PPS and LCP.
Product
Stanyl® TS250F6D is an electro-friendly & flame-retarded high heat polyamide that offers excellent creep resistance, strength, stiffness and fatigue resistance especially at high temperatures in combination with cycle-time advantages and excellent flow.
Special features
  • Heat stabilized
  • Improved resistance to blistering
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • CALIFORNIA PROPOSITION 65 (antimony oxide)2024-01-02
  • CALIFORNIA PROPOSITION 65 (carbon black and antimony oxide)2024-01-02
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
  • WEEE brominated flame retardants2022-03-07
Yellow Card
Processing technology
Injection Molding
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage [parallel]
0.4
%
Molding shrinkage [normal]
1.1
%
Spiral flow length 1.0 mm 800 bar
130
mm
Spiral flow length 1.0 mm 900 bar
145
mm
Spiral flow length 1.0 mm 1000 bar
160
mm
Spiral flow length 0.5mm 1200 bar
60
mm
Spiral flow length 0.5 mm 1600 bar
90
mm
Spiral flow length 0.5mm 2000 bar
110
mm

Mechanical properties

Tensile modulus
12400
MPa
Tensile modulus (120°C)
7300
MPa
Tensile modulus (160°C)
5500
MPa
Tensile modulus, low thickness
12400
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
180
MPa
Stress at break (120°C)
100
MPa
Stress at break (160°C)
80
MPa
Stress at break, at low thickness
180
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.2
%
Strain at break (120°C)
4
%
Strain at break (160°C)
6
%
Strain at break, at low thickness
2.1
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
11300
MPa
Flexural modulus (120°C)
6500
MPa
Flexural modulus (160°C)
5000
MPa
Flexural strength
250
MPa
Flexural strength (120°C)
170
MPa
Flexural strength (160°C)
140
MPa
Charpy impact strength (+23°C)
60
kJ/m²
Charpy impact strength (-30°C)
50
kJ/m²
Charpy notched impact strength (+23°C)
12
kJ/m²
Charpy notched impact strength (-30°C)
11
kJ/m²
Izod notched impact strength (+23°C)
11
kJ/m²
Izod notched impact strength (-40°C)
11
kJ/m²
Weldline strength at thickness 1
60
MPa
Weldline strain at thickness 1
0.65
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
65
MPa
Weldline strain at thickness 2
0.65
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
295
°C
Glass transition temperature (10°C/min)
75
°C
Temp. of deflection under load (1.80 MPa)
290
°C
Temp. of deflection under load (0.45 MPa)
290
°C
Vicat softening temperature (50°C/h 50N)
290
°C
Coeff. of linear therm. expansion (parallel)
0.25
E-4/°C
Coeff. of linear therm. expansion (normal)
0.55
E-4/°C
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
Thickness tested
3
mm
UL recognition
Yes
-
Oxygen index
37
%
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
3
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
0.75
mm
Glow Wire Ignition Temperature GWIT
930
°C
GWIT (Thickness (1) tested)
3
mm
Glow Wire Ignition Temperature GWIT
825
°C
GWIT (Thickness (2) tested)
0.75
mm
Relative Temperature Index - electrical
140
°C
RTI electrical (Thickness (1) tested)
0.67
mm
Relative Temperature Index - electrical
140
°C
RTI electrical (Thickness (2) tested)
3
mm
Relative Temperature Index - with impact
110
°C
RTI with impact (Thickness (1) tested)
0.67
mm
Relative Temperature Index - with impact
130
°C
RTI with impact (Thickness (2) tested)
3
mm
Relative Temperature Index - without impact
120
°C
RTI without impact (Thickness (1) tested)
0.67
mm
Relative Temperature Index - without impact
130
°C
RTI without impact (Thickness (2) tested)
3
mm
Thermal Index 2500 hrs
175
°C
Thermal Index 5000 hrs
163
°C
Thermal Index 10000 hrs
152
°C
Thermal Index 20000 hrs
141
°C

Electrical properties

Relative permittivity (100Hz)
4.3
-
Relative permittivity (1 MHz)
4
-
Relative permittivity (1GHz)
3.6
-
Dissipation factor (100 Hz)
60
E-4
Dissipation factor (1 MHz)
160
E-4
Dissipation factor (1GHz)
250
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
30
kV/mm
Comparative tracking index
250
V

Other properties

Water absorption
5.5
%
Water absorption in water at 23°C after 24h
1.55
%
Humidity absorption
1.6
%
Density
1680
kg/m³

Material specific properties

Viscosity number
160
cm³/g

Rheological calculation properties

Density of melt
1470
kg/m³
Thermal conductivity of melt
0.271
W/(m K)
Spec. heat capacity melt
1770
J/(kg K)
Eff. thermal diffusivity
1.05E-7
m²/s

Diagrams

Applications

FPC connectors

Industry
Electronics
Material
  • •} Reduced environmental impact due to lower carbon footprint
  • •} Low warpage
  • •} Low moisture absorption
  • •} High melt temperature (325°C, 617°F)
  • •} High glass transition temperature (125°C, 257°F)
}
More information

Reflow connectors

Industry
Electronics
Material
  • •} Cost-effective
  • •} High flowability
  • •} Enable thin-wall designs
  • •} Low moisture absorption
  • •} Flame retardant
}
More information

WtB and BtB Connectors

Industry
Electronics
Material
  • •} Good processability
  • •} Enables thin-walled designs
  • •} Alternative to liquid crystal polymer
  • •} Available in halogen- and red phosphorous-free grades
}
More information