ForTii® TX1

30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
Special features
  • Phosphorous free
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • CALIFORNIA PROPOSITION 65 (NDS)2024-01-02
  • CALIFORNIA PROPOSITION 65 (carbon black)2024-01-02
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Automotive OEM
HYUNDAI KIA
OEM Specification
MS-941-03-(2022)
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.35
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 800 bar
110
mm
Spiral flow length 1.0 mm 900 bar
120
mm
Spiral flow length 1.0 mm 1000 bar
130
mm

Mechanical properties

Tensile modulus
11500
MPa
Tensile modulus (120°C)
8000
MPa
Tensile modulus (160°C)
5000
MPa
Tensile modulus, low thickness
10700
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
150
MPa
Stress at break (120°C)
95
MPa
Stress at break (160°C)
65
MPa
Stress at break, at low thickness
155
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2
%
Strain at break (120°C)
2.5
%
Strain at break (160°C)
3.6
%
Strain at break, at low thickness
2.1
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
11000
MPa
Flexural strength
240
MPa
Charpy impact strength (+23°C)
47
kJ/m²
Charpy notched impact strength (+23°C)
7
kJ/m²
Weldline strength at thickness 2
60
MPa
Weldline strain at thickness 2
0.7
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Temp. of deflection under load (1.80 MPa)
305
°C
Temp. of deflection under load (0.45 MPa)
323
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.65
E-4/°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.35
E-4/°C
Thermal conductivity in plane
0.4
W/(m K)
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
Thickness tested
3
mm
UL recognition
Yes
-
Oxygen index
39
%
Ball pressure temperature
305
°C
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
3
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
0.75
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (1) tested)
3
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (2) tested)
0.75
mm
Relative Temperature Index - electrical
130
°C
RTI electrical (Thickness (1) tested)
0.75
mm
Relative Temperature Index - electrical
120
°C
RTI electrical (Thickness (2) tested)
0.35
mm
Relative Temperature Index - with impact
110
°C
RTI with impact (Thickness (1) tested)
0.75
mm
Relative Temperature Index - with impact
120
°C
RTI with impact (Thickness (2) tested)
1.5
mm
Relative Temperature Index - without impact
120
°C
RTI without impact (Thickness (1) tested)
0.75
mm
Relative Temperature Index - without impact
130
°C
RTI without impact (Thickness (2) tested)
1.5
mm

Electrical properties

Relative permittivity (100Hz)
4.2
-
Relative permittivity (1 MHz)
3.9
-
Relative permittivity (1GHz)
3.8
-
Dissipation factor (100 Hz)
64
E-4
Dissipation factor (1 MHz)
176
E-4
Dissipation factor (1GHz)
130
E-4
Electric strength
33
kV/mm
Comparative tracking index
600
V
Comparative Tracking Index (above 600V)
≥800V
V

Other properties

Water absorption
4.1
%
Water absorption in water at 23°C after 24h
0.3
%
Humidity absorption
1.6
%
Density
1460
kg/m³

Material specific properties

Viscosity number
86
cm³/g

Diagrams

Applications

Audio Jack Connectors

Industry
Electronics
Material
  • •} Cost-effective
  • •} High flowability
  • •} Low moisture absorption
  • •} Flame retardant
}
More information

Automotive Reflow Connectors

Industry
Automotive
Material
  • •} Reliable
  • •} High temperature resistant
  • •} High melting point
  • •} Cost effective
  • •} High co-planarity
  • •} Low warpage after soldering
  • •} High mechanical performance
  • •} High flowability enables thin wall designs
}
More information

DDR DIMM Connectors

Industry
Electronics
Material
  • •} Sustainable solution due to good carbon footprint
  • •} Flame retardant
  • •} Halogen-free
  • •} Red-phosphorous free
}
More information

Fakra connectors

Industry
Automotive
Material
  • •} Reflow soldering
  • •} High weldline strength vs other PPAs
  • •} Broad color portfolio
  • •} For JTX8 solid JEDEC1 performance
  • •} High material flow
}
More information

High voltage connector

Industry
Automotive
Material
Application requirements Superior electrical performance Dedicated high voltage High mechanical strength Material properties CTI 600V, RTI 140°C Halogen-free UL94-V0 @ 0.75mm Superior processability}
More information

Power Connectors

Industry
Electronics
Material
  • •} Good processability
  • •} High flowability
  • •} Enables thin-walled designs
  • •} Sustainable solution
  • •} Lower carbon footprint
}
More information

Reflow connectors (3)

Industry
Electronics
Material
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
More information