ForTii® Eco LDS62B

35% Glass Reinforced, Laser Direct Structuring (LDS), Low Warpage

Back to results

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® Eco in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® Eco LDS62B is a high ductility LDS material which enables good structural integrity in complicated geometries. It is well suited for wearable devices and smart phone antennas for consumer electronics. It has excellent dimensional stability to ensure low warpage after chemical plating. Eco LDS62B is Eco-friendly due to its partly bio-based content.

Sustainability
Bio-based
Special features
  • Laser Direct Structuring
  • Low warpage
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-06-27
Yellow Card
Processing technology
Injection Molding
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.21
%
Molding shrinkage (normal)
0.7
%

Mechanical properties

Tensile modulus
11500
MPa
Stress at break
130
MPa
Strain at break
1.7
%
Flexural modulus
10000
MPa
Flexural strength
190
MPa
Charpy notched impact strength (+23°C)
4.6
kJ/m²

Thermal properties

Melting temperature (10°C/min)
319
°C
Temp. of deflection under load (1.80 MPa)
235
°C
Coeff. of linear therm. expansion (parallel)
0.17
E-4/°C
Coeff. of linear therm. expansion (normal)
0.66
E-4/°C
Burning Behav. at 1.5 mm nom. thickn.
HB
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-

Electrical properties

Relative permittivity (1GHz)
3.74
-
Relative permittivity (5GHz)
3.7
-
Dissipation factor (1GHz)
137
E-4
Dissipation factor (5GHz)
109
E-4

Other properties

Density
1500
kg/m³

Applications

Integrated Mobile Antenna

Industry
Electronics
Material
  • •} Conductive track by LDS
  • •} Good aesthetics
  • •} Combination of lasertransparent and laserweldable
}
More information

Robotic connectors & circuitry

Industry
Robotics
Material
  • •} Stanyl® and ForTii® are proven solutions for connectors used by many of the world's leading automakers and electronics manufacturers.
  • •} Superior strength and durability vs liquid crystal polymers (LCP) and other thermoplastics.
  • •} Material solutions formulated for laser direct structuring for precision processing.
}
More information