ForTii® WX12-FC

40% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® WX12-FC has excellent hydrolysis resistance, processability and surface quality and is ideal for complex and thin walled food and water contact applications. For detailed statements and information regarding food contact and water contact approvals please contact your Envalior representative.
Special features
  • USP class VI classified
  • Drinking Water Contact Grade
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-04-25
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Food Contact Canada Information (LONO)2019-07-08
  • Food Contact Declaration Europe ForTii®2023-08-10
  • Food Contact Declaration MERCOSUR ForTii®2023-11-06
  • Food Contact Declaration USA ForTii®2024-04-03
  • Food Contact India Information Letter2023-05-11
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
Yellow Card
Processing technology
Injection Molding
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.35
%
Molding shrinkage (normal)
1
%

Mechanical properties

Tensile modulus
14500
MPa
Tensile modulus (-40°C)
14800
MPa
Tensile modulus (120°C)
9500
MPa
Stress at break
225
MPa
Stress at break (-40°C)
250
MPa
Stress at break (120°C)
130
MPa
Strain at break
2.1
%
Strain at break (-40°C)
2.2
%
Strain at break (120°C)
5
%
Flexural modulus
14000
MPa
Flexural strength
350
MPa
Charpy notched impact strength (+23°C)
11
kJ/m²

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass Transition Temperature from DMTA (tan d)
130
°C
Temp. of deflection under load (1.80 MPa)
305
°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.35
E-4/°C
Burning Behav. at 1.5 mm nom. thickn.
HB
class
Thickness tested
1.5
mm
UL recognition
Yes
-

Electrical properties

Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
35
kV/mm

Other properties

Humidity absorption
1.6
%
Density
1540
kg/m³