ForTii® JTX2

30% Glass Reinforced, PA4T, Electro-friendly

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® JTX2 has robust mechanical performance and has good reliability in thermal ageing and mechanical shocks. JTX2 has consistent performance in injection molding processing and a low risk of blistering due to its JEDEC MLS 1 rating for specified thicknesses. JTX2 is the best candidate for HB reflow headers/connectors in (automotive) electronics.


Special features
Regulatory Affairs
Processing technology
Injection Molding
Automotive OEM
HYUNDAI KIA, VW
OEM Specification
MS-941-03-(2022)
VW50180 (2015-05)

Rheological properties

Molding shrinkage (parallel)
0.4
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 1000 bar
90
mm

Mechanical properties

Tensile modulus
11300
MPa
Tensile modulus (80°C)
10500
MPa
Tensile modulus (120°C)
8000
MPa
Tensile modulus (160°C)
4500
MPa
Tensile modulus (200°C)
4000
MPa
Tensile modulus, low thickness
10800
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
200
MPa
Stress at break (80°C)
180
MPa
Stress at break (120°C)
135
MPa
Stress at break (160°C)
90
MPa
Stress at break (200°C)
75
MPa
Stress at break, at low thickness
200
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.2
%
Strain at break (80°C)
2.6
%
Strain at break (120°C)
4.3
%
Strain at break (160°C)
6
%
Strain at break (200°C)
6
%
Strain at break, at low thickness
2.5
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
10500
MPa
Flexural modulus (80°C)
10000
MPa
Flexural modulus (120°C)
7500
MPa
Flexural modulus (160°C)
4500
MPa
Flexural modulus (200°C)
4000
MPa
Flexural strength
300
MPa
Flexural strength (80°C)
260
MPa
Flexural strength (120°C)
180
MPa
Flexural strength (160°C)
120
MPa
Flexural strength (200°C)
100
MPa
Charpy impact strength (+23°C)
60
kJ/m²
Charpy impact strength (-30°C)
55
kJ/m²
Charpy notched impact strength (+23°C)
10
kJ/m²
Charpy notched impact strength (-30°C)
10
kJ/m²
Weldline strength at thickness 1
70
MPa
Weldline strain at thickness 1
0.7
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
100
MPa
Weldline strain at thickness 2
1.2
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Glass Transition Temperature from DMTA (tan d)
130
°C
Temp. of deflection under load (1.80 MPa)
305
°C
Temp. of deflection under load (0.45 MPa)
320
°C
Coeff. of linear therm. expansion (parallel)
0.18
E-4/°C
Coeff. of linear therm. expansion (normal)
0.6
E-4/°C
Coeff. of linear therm. expansion (parallel)
0.33
E-4/°C
Coeff. of linear therm. expansion (normal)
0.4
E-4/°C
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-
Thermal Index 2500 hrs
180
°C
Thermal Index 5000 hrs
167
°C
Thermal Index 10000 hrs
154
°C
Thermal Index 20000 hrs
142
°C

Electrical properties

Relative permittivity (100Hz)
5
-
Relative permittivity (1 MHz)
4.5
-
Relative permittivity (1GHz)
3.9
-
Relative permittivity (10GHz)
3.8
-
Dissipation factor (100 Hz)
150
E-4
Dissipation factor (1 MHz)
280
E-4
Dissipation factor (1GHz)
140
E-4
Dissipation factor (10GHz)
120
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
43
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
5.1
%
Water absorption in water at 23°C after 24h
0.4
%
Humidity absorption
2
%
Density
1430
kg/m³

Diagrams

Applications

Automotive Reflow Connectors

Industry
Automotive
  • •} Reliable
  • •} High temperature resistant
  • •} High melting point
  • •} Cost effective
  • •} High co-planarity
  • •} Low warpage after soldering
  • •} High mechanical performance
  • •} High flowability enables thin wall designs
}

Car computer control system

Industry
Automotive
Application requirements Superior mechanical and electrical performance Dedicated color portfolio High mechanical strength No blistering Material properties CTI 600V, RTI 140°C Halogen-free and free of ionic heat stabilizers HB and UL94 V0 option High mechanical strength}

Fakra connectors

Industry
Automotive
  • •} Reflow soldering
  • •} High weldline strength vs other PPAs
  • •} Broad color portfolio
  • •} For JTX8 solid JEDEC1 performance
  • •} High material flow
}