ForTii® Ace JTX8

30% Glass Reinforced, PA4T, Electro-friendly, Improved resistance to blistering during reflow - soldering process, Improved color stability

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
ForTii® Ace is a PPA with a high Glass Transition Temperature, with extreme chemical resistance, suitable for applications that need high mechanics at elevated temperatures.
Product

ForTii® Ace JTX8 is the only polyamide grade in the world that secures, in all product designs, the JEDEC MSL 1 rating at all thicknesses. Ace JTX8 has the highest Tg available in polyamides (160°C) to satisfy various industry requirements like chemical resistance and high temperature thermal ageing. Ace JTX8 has extremely robust processing performance and allows 100% regrinding with high mechanical properties retention.

Special features
  • Improved resistance to blistering
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • CALIFORNIA PROPOSITION 65 (carbon black)2024-01-02
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Automotive OEM
PSA
OEM Specification
STELLANTIS - 01994-16-00164-MAN-01378-20-00217-(2021-07)
Applications
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Rheological properties

Molding shrinkage (parallel)
0.43
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 1000 bar
60
mm

Mechanical properties

Tensile modulus
11000
MPa
Tensile modulus (-40°C)
11700
MPa
Tensile modulus (40°C)
10500
MPa
Tensile modulus (80°C)
10300
MPa
Tensile modulus (100°C)
10200
MPa
Tensile modulus (120°C)
9500
MPa
Tensile modulus (160°C)
6000
MPa
Tensile modulus (200°C)
4000
MPa
Tensile modulus, low thickness
11000
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
210
MPa
Stress at break (-40°C)
240
MPa
Stress at break (40°C)
200
MPa
Stress at break (80°C)
180
MPa
Stress at break (100°C)
170
MPa
Stress at break (120°C)
150
MPa
Stress at break (160°C)
100
MPa
Stress at break (200°C)
75
MPa
Stress at break, at low thickness
220
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.7
%
Strain at break (-40°C)
2.8
%
Strain at break (40°C)
2.6
%
Strain at break (80°C)
2.8
%
Strain at break (100°C)
2.7
%
Strain at break (120°C)
3
%
Strain at break (160°C)
5
%
Strain at break (200°C)
6
%
Strain at break, at low thickness
3
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
10500
MPa
Flexural modulus (80°C)
10000
MPa
Flexural modulus (120°C)
9500
MPa
Flexural modulus (160°C)
5700
MPa
Flexural modulus (200°C)
3900
MPa
Flexural strength
300
MPa
Flexural strength (80°C)
270
MPa
Flexural strength (120°C)
220
MPa
Flexural strength (160°C)
140
MPa
Flexural strength (200°C)
110
MPa
Charpy impact strength (+23°C)
70
kJ/m²
Charpy impact strength (-30°C)
65
kJ/m²
Charpy notched impact strength (+23°C)
10
kJ/m²
Charpy notched impact strength (-30°C)
10
kJ/m²
Weldline strength at thickness 1
90
MPa
Weldline strain at thickness 1
1.1
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
120
MPa
Weldline strain at thickness 2
1.6
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
340
°C
Glass transition temperature (10°C/min)
150
°C
Glass Transition Temperature from DMTA (tan d)
160
°C
Temp. of deflection under load (1.80 MPa)
320
°C
Temp. of deflection under load (0.45 MPa)
335
°C
Coeff. of linear therm. expansion (parallel)
0.18
E-4/°C
Coeff. of linear therm. expansion (normal)
0.6
E-4/°C
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-
Thermal Index 2500 hrs
188
°C
Thermal Index 5000 hrs
174
°C
Thermal Index 10000 hrs
161
°C
Thermal Index 20000 hrs
149
°C

Electrical properties

Relative permittivity (1GHz)
3.92
-
Relative permittivity (5GHz)
3.85
-
Relative permittivity (10GHz)
3.83
-
Dissipation factor (1GHz)
170
E-4
Dissipation factor (5GHz)
140
E-4
Dissipation factor (10GHz)
120
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
45
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
4.8
%
Water absorption in water at 23°C after 24h
0.2
%
Humidity absorption
2
%
Density
1460
kg/m³

JSON SPT

Molding shrinkage (parallel)
0.43
%
Molding shrinkage (normal)
1.2
%

Diagrams

Applications

Automotive Reflow Connectors

Industry
Automotive
Material
  • •} Reliable
  • •} High temperature resistant
  • •} High melting point
  • •} Cost effective
  • •} High co-planarity
  • •} Low warpage after soldering
  • •} High mechanical performance
  • •} High flowability enables thin wall designs
}
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Car computer control system

Industry
Automotive
Material
Application requirements Superior mechanical and electrical performance Dedicated color portfolio High mechanical strength No blistering Material properties CTI 600V, RTI 140°C Halogen-free and free of ionic heat stabilizers HB and UL94 V0 option High mechanical strength}
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Fakra connectors

Industry
Automotive
Material
  • •} Reflow soldering
  • •} High weldline strength vs other PPAs
  • •} Broad color portfolio
  • •} For JTX8 solid JEDEC1 performance
  • •} High material flow
}
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Infotainment System Fakra Connector

Industry
Electronics
Material
There is an enormous increase in infotainment systems – connected cars ForTii® Ace JTX8 can be processed, blistering free under high temperature reflow soldering. ForTii® Ace JTX8 is the only polyamide material meeting JEDEC1 level at all thicknesses. Stable DK performance up to 10GHz. Full coloring range and highest color stability after reflow. High stiffness retention during reflow (Tp=260c). Superior chemical resistance.}
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Robotic connectors & circuitry

Industry
Robotics
Material
  • •} Stanyl® and ForTii® are proven solutions for connectors used by many of the world's leading automakers and electronics manufacturers.
  • •} Superior strength and durability vs liquid crystal polymers (LCP) and other thermoplastics.
  • •} Material solutions formulated for laser direct structuring for precision processing.
}
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