Durethan® BKV30XTS3
30% Glass Reinforced, Injection Molding, Heat Stabilized
General Information
Durethan® is the trade name for our range of engineering thermoplastics based on polyamide 6 and polyamide 66. These polyamides are partially crystalline thermoplastics which offer an ideal combination of properties, especially for technical applications. They provide high mechanical strength and stiffness, good dielectric properties, high resistance to both heat and chemical attack, and good friction and wear properties.
Special features
- Heat stabilized
General Document
Regulatory Affairs
- Absence Declaration BNST2023-11-16
- Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
- Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
- Absence Declaration Nano Materials2023-11-16
- Absence Declaration Ozone Depleting Chemicals2024-06-27
- Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
- Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
- Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
- Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
- Absence Declaration Red Phosphorus2023-11-16
- Conflict minerals declaration (EICC, GeSI)2024-05-15
- REACH Registration Statement2024-03-27
- RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
- SVHC, REACH Annex XIV and –XVII Statement2024-06-27
Yellow Card
Processing technology
Injection Molding
Injection Molding
Rheological properties
Molding shrinkage (parallel)
0.25
%
ISO 294-4
Molding shrinkage (normal)
0.7
%
ISO 294-4
Mechanical properties
Tensile modulus
10100
MPa
ISO 527-1/-2
Tensile modulus (-40°C)
10900
MPa
ISO 527-1/-2
Tensile modulus (40°C)
8010
MPa
ISO 527-1/-2
Tensile modulus (100°C)
4570
MPa
ISO 527-1/-2
Tensile modulus (120°C)
4280
MPa
ISO 527-1/-2
Tensile modulus (140°C)
4030
MPa
ISO 527-1/-2
Tensile modulus (160°C)
3770
MPa
ISO 527-1/-2
Tensile modulus (180°C)
3490
MPa
ISO 527-1/-2
Tensile modulus (200°C)
3120
MPa
ISO 527-1/-2
Stress at break
185
MPa
ISO 527-1/-2
Strain at break
3.5
%
ISO 527-1/-2
Flexural modulus
9400
MPa
ISO 178
Flexural strength
270
MPa
ISO 178
Charpy impact strength (+23°C)
80
kJ/m²
ISO 179/1eU
Charpy impact strength (-30°C)
60
kJ/m²
ISO 179/1eU
Charpy notched impact strength (+23°C)
11
kJ/m²
ISO 179/1eA
Charpy notched impact strength (-30°C)
<10
kJ/m²
ISO 179/1eA
Izod notched impact strength (+23°C)
12
kJ/m²
ISO 180/1A
Thermal properties
Melting temperature (10°C/min)
221
°C
ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa)
200
°C
ISO 75-1/-2
Temp. of deflection under load (0.45 MPa)
215
°C
ISO 75-1/-2
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
ISO 11359-1/-2
Coeff. of linear therm. expansion (normal)
1.1
E-4/°C
ISO 11359-1/-2
Burning Behav. at 0.75 mm nom. thickn.
HB
class
IEC 60695-11-10
Thickness tested
0.75
mm
IEC 60695-11-10
Burning Behav. at 1.5 mm nom. thickn.
HB
class
IEC 60695-11-10
Thickness tested
1.5
mm
IEC 60695-11-10
Ball pressure temperature
205
°C
IEC 60695-10-2
Glow Wire Flammability Index GWFI
725
°C
IEC 60695-2-12
GWFI (Thickness (1) tested)
0.8
mm
IEC 60695-2-12
Glow Wire Flammability Index GWFI
725
°C
IEC 60695-2-12
GWFI (Thickness (2) tested)
1.5
mm
IEC 60695-2-12
Glow Wire Ignition Temperature GWIT
750
°C
IEC 60695-2-13
GWIT (Thickness (1) tested)
0.8
mm
IEC 60695-2-13
Glow Wire Ignition Temperature GWIT
750
°C
IEC 60695-2-13
GWIT (Thickness (2) tested)
1.5
mm
IEC 60695-2-13
Electrical properties
Relative permittivity (100Hz)
3.65
-
IEC 62631-2-1
Relative permittivity (1 MHz)
4.66
-
IEC 62631-2-1
Dissipation factor (100 Hz)
0.03
E-4
IEC 62631-2-1
Dissipation factor (1 MHz)
0.03
E-4
IEC 62631-2-1
Volume resistivity
3.88E12
Ohm*m
IEC 62631-3-1
Surface resistivity
Ohm
IEC 62631-3-2
Electric strength
32.9
kV/mm
IEC 60243-1
Comparative tracking index
500
V
IEC 60112
Other properties
Density
1360
kg/m³
ISO 1183
Material specific properties
Drying temperature dry air dryer
80
°C
Drying time dry air dryer
2-6
h
Residual moisture content
0.03-0.12
%
acc. to Karl Fischer
Melt temperature (Tmin - Tmax)
270-290
°C
Mold temperature
80-100
°C
admissible residence time at Tmax
<5
min
