Akulon® S223-E

Low/Medium Viscosity

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General Information

Akulon® is our family of high performance polyamide 6 and polyamide 66 materials, used by customers across the world in applications ranging from automotive, electronics & electrical, to furniture and packaging.
We offer Akulon® grades for injection molding, blow molding and extrusion (including barrier film, stock shapes, convoluted tubes, and mono and multi filament).
In molded parts the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile for extrusion the strength, resilience and easy processing of Akulon® sets the market standards.
Special features
  • Low viscosity
  • Medium viscosity
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • CALIFORNIA PROPOSITION 65 (NDS)2024-01-02
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Applications
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Rheological properties

Molding shrinkage [parallel]
1.6
%
Molding shrinkage [normal]
1.6
%

Mechanical properties

Tensile modulus
3500
MPa
Yield stress
95
MPa
Yield strain
3.5
%
Nominal strain at break
10
%
Flexural modulus
2800
MPa
Flexural strength
125
MPa
Charpy impact strength (+23°C)
N
kJ/m²
Charpy impact strength (-30°C)
N
kJ/m²
Charpy notched impact strength (+23°C)
6
kJ/m²
Charpy notched impact strength (-30°C)
6
kJ/m²

Thermal properties

Melting temperature (10°C/min)
260
°C
Temp. of deflection under load (1.80 MPa)
80
°C
Temp. of deflection under load (0.45 MPa)
225
°C
Coeff. of linear therm. expansion (parallel)
1
E-4/°C
Coeff. of linear therm. expansion (normal)
1
E-4/°C
Burning Behav. at 0.4 mm nom. thickn.
V-2
class
Thickness tested
0.4
mm
Burning Behav. at 1.5 mm nom. thickn.
V-2
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-2
class
Thickness tested
3
mm
UL recognition
Yes
-

Electrical properties

Relative permittivity (100Hz)
3.2
-
Relative permittivity (1 MHz)
3
-
Dissipation factor (100 Hz)
60
E-4
Dissipation factor (1 MHz)
170
E-4
Volume resistivity
1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
25
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
8.5
%
Humidity absorption
2.3
%
Density
1140
kg/m³

Rheological calculation properties

Density of melt
969
kg/m³
Thermal conductivity of melt
0.13
W/(m K)
Spec. heat capacity melt
2750
J/(kg K)
Eff. thermal diffusivity
4.87E-8
m²/s

Diagrams

Applications

Terminal Blocks

Industry
Electrical
Material
  • •} Most grades are available now also with halogenfree flame-retardant ingredients
  • •} Stanyl® PA46 and ForTii® PA4T to be used for SMT versions
}
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