Stanyl® HFX61S

35% Glass Reinforced, High Flow, Halogen free and free of red phosphorous

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General Information

Stanyl® is our high-performance polyamide 46 used for applications in automotive, E&E, gears and outdoor power equipments.
Stanyl® is a high performance polyamide that provides unmatched performance and value for demanding applications in which superior heat resistance, design stiffness, wear & friction and process flow qualities are required.
Because Stanyl retains its mechanical properties at high temperatures up to 220°C, this makes it ideal for extremely high-performance applications, where it outperforms PPA, PA6T, PA9T, and often PPS and LCP.
Product
Stanyl® HFX61S is an electro-friendly & halogen-free flame-retarded high heat polyamide that offers an excellent combination of high CTI, flow and weld-line strength. HFX-grades are often used in connectors such as USB type C.
Special features
  • Good or high flow
  • Phosphorous free
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Design challenge
Downsizing & Miniaturization
Flame Retardancy | Halogen free
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.4
%
Molding shrinkage (normal)
1.1
%
Spiral flow length 1.0 mm 1000 bar
170
mm

Mechanical properties

Tensile modulus
11800
MPa
Tensile modulus (120°C)
6400
MPa
Tensile modulus (160°C)
5700
MPa
Tensile modulus, low thickness
11500
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
140
MPa
Stress at break (120°C)
83
MPa
Stress at break (160°C)
70
MPa
Stress at break, at low thickness
150
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.4
%
Strain at break (120°C)
4
%
Strain at break (160°C)
4.4
%
Strain at break, at low thickness
2.4
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
10500
MPa
Flexural modulus (120°C)
6900
MPa
Flexural modulus (160°C)
6300
MPa
Flexural strength
210
MPa
Flexural strength (120°C)
135
MPa
Flexural strength (160°C)
115
MPa
Charpy impact strength (+23°C)
50
kJ/m²
Charpy notched impact strength (+23°C)
9
kJ/m²
Weldline strength at thickness 1
40
MPa
Weldline strain at thickness 1
0.45
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
50
MPa
Weldline strain at thickness 2
0.55
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
295
°C
Glass transition temperature (10°C/min)
75
°C
Temp. of deflection under load (1.80 MPa)
285
°C
Coeff. of linear therm. expansion (parallel)
0.17
E-4/°C
Coeff. of linear therm. expansion (normal)
0.7
E-4/°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.4
E-4/°C
Burning Behav. at thickness h
V-0
class
Thickness tested
0.18
mm
UL recognition
Yes
-
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
Thickness tested
3
mm
UL recognition
Yes
-
Oxygen index
48
%
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
0.8
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
3
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (1) tested)
0.8
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (2) tested)
3
mm
Relative Temperature Index - electrical
120
°C
RTI electrical (Thickness (1) tested)
0.18
mm
Relative Temperature Index - electrical
130
°C
RTI electrical (Thickness (2) tested)
3
mm
Relative Temperature Index - with impact
115
°C
RTI with impact (Thickness (1) tested)
0.4
mm
Relative Temperature Index - with impact
115
°C
RTI with impact (Thickness (2) tested)
3
mm
Relative Temperature Index - without impact
115
°C
RTI without impact (Thickness (1) tested)
0.4
mm
Relative Temperature Index - without impact
115
°C
RTI without impact (Thickness (2) tested)
3
mm

Electrical properties

Relative permittivity (100Hz)
4.4
-
Relative permittivity (1 MHz)
4.1
-
Relative permittivity (1GHz)
3.9
-
Relative permittivity (10GHz)
3.8
-
Dissipation factor (100 Hz)
72
E-4
Dissipation factor (1 MHz)
165
E-4
Dissipation factor (1GHz)
120
E-4
Dissipation factor (10GHz)
100
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
30
kV/mm
Comparative tracking index
550
V

Other properties

Water absorption
6.3
%
Water absorption in water at 23°C after 24h
1.7
%
Humidity absorption
2
%
Density
1510
kg/m³

JSON SPT

Molding shrinkage (parallel)
0.4
%
Molding shrinkage (normal)
1.1
%

Diagrams

Applications

E-Motors for Power Tools

Industry
Consumer goods
Material
  • •} Current e-motor applications are packed tight with little to no room to gain additional power or improve efficiency. With Stanyl® PA46, you can mold thinner walls (i.e., lamina stack insulation) down to .25 mm or less, allowing more room for copper windings or thicker gauge to maximize torque potential and reduce resistance.
  • •} At high loads, e-motors generate substantial heat. Temperatures can easily exceed 150°C (302°F), resulting in mechanical failures. Stanyl® PA46 offers excellent high temperature mechanical performance with a heat deflection temperature of 290°C (554°F) and a continuous use temperature of 170°C (338°F).
  • •} The superior flow and high crystallinity of Stanyl® PA46 results in strong and flexible weld lines, improving manufacturing yield by eliminating process scrap in rotors and stators.
}
More information

Audio Jack Connectors

Industry
Electronics
Material
  • •} Cost-effective
  • •} High flowability
  • •} Low moisture absorption
  • •} Flame retardant
}
More information

DDR DIMM Connectors

Industry
Electronics
Material
  • •} Sustainable solution due to good carbon footprint
  • •} Flame retardant
  • •} Halogen-free
  • •} Red-phosphorous free
}
More information

Miniature Circuit Breakers

Industry
Electrical
Material
  • •} Halogen-free
  • •} Flame retardant
  • •} Heat-stabilized
  • •} Strength and resilience
  • •} Easy processing
}
More information

Molded case circuit breakers

Industry
Electrical
Material
Most grades are available with halogenfree flameretardancy, and in specific electro-grey colour for housings.}
More information

Reflow connectors (2)

Industry
Electronics
Material
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
More information

Robotic connectors & circuitry

Industry
Robotics
Material
  • •} Stanyl® and ForTii® are proven solutions for connectors used by many of the world's leading automakers and electronics manufacturers.
  • •} Superior strength and durability vs liquid crystal polymers (LCP) and other thermoplastics.
  • •} Material solutions formulated for laser direct structuring for precision processing.
}
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USB-C Connectors

Industry
Electronics
Material
  • •} Glass-reinforced
  • •} Provides up to 50% more wear resistance compared to other high temperature polyamides
  • •} Enables thinner wall designs
  • •} Halogen and red phosphorous-free grades are available
}
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