ForTii® JTX2
30% Glass Reinforced, PA4T, Electro-friendly
General Information
ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® JTX2 has robust mechanical performance and has good reliability in thermal ageing and mechanical shocks. JTX2 has consistent performance in injection molding processing and a low risk of blistering due to its JEDEC MLS 1 rating for specified thicknesses. JTX2 is the best candidate for HB reflow headers/connectors in (automotive) electronics.
Special features
General Document
Regulatory Affairs
- Absence Declaration BNST2023-11-16
- Absence Declaration Biocidal Products2023-11-16
- Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
- Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
- Absence Declaration EPA 20 High Priority Substances 20192023-11-16
- Absence Declaration Food Allergens2023-11-16
- Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
- Absence Declaration Nano Materials2023-11-16
- Absence Declaration Ozone Depleting Chemicals2024-06-27
- Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
- Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
- Absence Declaration PFAS2024-03-05
- Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
- Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
- Absence Declaration Red Phosphorus2023-11-16
- Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
- CALIFORNIA PROPOSITION 65 (NDS)2024-01-02
- CALIFORNIA PROPOSITION 65 (carbon black)2024-01-02
- Compliance Statement EU Sanctions and Embargos2024-05-16
- Conflict minerals declaration (EICC, GeSI)2024-05-15
- Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
- Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
- Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
- REACH Registration Statement2024-03-27
- REACH STATEMENT KOREA2023-11-16
- REACH STATEMENT TURKYE2023-11-16
- RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
- SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Injection Molding
Automotive OEM
HYUNDAI KIA, VW
HYUNDAI KIA, VW
OEM Specification
MS-941-03-(2022)
VW50180 (2015-05)
MS-941-03-(2022)
VW50180 (2015-05)
Rheological properties
Molding shrinkage (parallel)
0.4
%
ISO 294-4
Molding shrinkage (normal)
1.2
%
ISO 294-4
Spiral flow length 1.0 mm 1000 bar
90
mm
-
Mechanical properties
Tensile modulus
11300
MPa
ISO 527-1/-2
Tensile modulus (80°C)
10500
MPa
ISO 527-1/-2
Tensile modulus (120°C)
8000
MPa
ISO 527-1/-2
Tensile modulus (160°C)
4500
MPa
ISO 527-1/-2
Tensile modulus (200°C)
4000
MPa
ISO 527-1/-2
Tensile modulus, low thickness
10800
MPa
ISO 527-1/-2
Tens. Mod. (Thickness tested)
1
mm
ISO 527-1/-2
Stress at break
200
MPa
ISO 527-1/-2
Stress at break (80°C)
180
MPa
ISO 527-1/-2
Stress at break (120°C)
135
MPa
ISO 527-1/-2
Stress at break (160°C)
90
MPa
ISO 527-1/-2
Stress at break (200°C)
75
MPa
ISO 527-1/-2
Stress at break, at low thickness
200
MPa
ISO 527-1/-2
Stress at break (Thickness tested)
1
mm
ISO 527-1/-2
Strain at break
2.2
%
ISO 527-1/-2
Strain at break (80°C)
2.6
%
ISO 527-1/-2
Strain at break (120°C)
4.3
%
ISO 527-1/-2
Strain at break (160°C)
6
%
ISO 527-1/-2
Strain at break (200°C)
6
%
ISO 527-1/-2
Strain at break, at low thickness
2.5
%
ISO 527-1/-2
Strain at break (Thickness tested)
1
mm
ISO 527-1/-2
Flexural modulus
10500
MPa
ISO 178
Flexural modulus (80°C)
10000
MPa
ISO 178
Flexural modulus (120°C)
7500
MPa
ISO 178
Flexural modulus (160°C)
4500
MPa
ISO 178
Flexural modulus (200°C)
4000
MPa
ISO 178
Flexural strength
300
MPa
ISO 178
Flexural strength (80°C)
260
MPa
ISO 178
Flexural strength (120°C)
180
MPa
ISO 178
Flexural strength (160°C)
120
MPa
ISO 178
Flexural strength (200°C)
100
MPa
ISO 178
Charpy impact strength (+23°C)
60
kJ/m²
ISO 179/1eU
Charpy impact strength (-30°C)
55
kJ/m²
ISO 179/1eU
Charpy notched impact strength (+23°C)
10
kJ/m²
ISO 179/1eA
Charpy notched impact strength (-30°C)
10
kJ/m²
ISO 179/1eA
Weldline strength at thickness 1
70
MPa
ISO 527-1/-2
Weldline strain at thickness 1
0.7
%
ISO 527-1/-2
Thickness tested (1)
4
mm
ISO 527-1/-2
Weldline strength at thickness 2
100
MPa
ISO 527-1/-2
Weldline strain at thickness 2
1.2
%
ISO 527-1/-2
Thickness tested (2)
1
mm
ISO 527-1/-2
Thermal properties
Melting temperature (10°C/min)
325
°C
ISO 11357-1/-3
Glass transition temperature (10°C/min)
125
°C
ISO 11357-1/-2
Glass Transition Temperature from DMTA (tan d)
130
°C
ASTM D5026/D7028
Temp. of deflection under load (1.80 MPa)
305
°C
ISO 75-1/-2
Temp. of deflection under load (0.45 MPa)
320
°C
ISO 75-1/-2
Coeff. of linear therm. expansion (parallel)
0.18
E-4/°C
ISO 11359-1/-2
Coeff. of linear therm. expansion (normal)
0.6
E-4/°C
ISO 11359-1/-2
Coeff. of linear therm. expansion (parallel)
0.33
E-4/°C
ASTM D696
Coeff. of linear therm. expansion (normal)
0.4
E-4/°C
ASTM D696
Burning Behav. at 3.0 mm nom. thickn.
HB
class
IEC 60695-11-10
Thickness tested
3
mm
IEC 60695-11-10
UL recognition
Yes
-
-
Thermal Index 2500 hrs
180
°C
IEC 60216/ISO 527-1/-2
Thermal Index 5000 hrs
167
°C
IEC 60216/ISO 527-1/-2
Thermal Index 10000 hrs
154
°C
IEC 60216/ISO 527-1/-2
Thermal Index 20000 hrs
142
°C
IEC 60216/ISO 527-1/-2
Electrical properties
Relative permittivity (100Hz)
5
-
IEC 62631-2-1
Relative permittivity (1 MHz)
4.5
-
IEC 62631-2-1
Relative permittivity (1GHz)
3.9
-
IEC 61189-2-721
Relative permittivity (10GHz)
3.8
-
IEC 61189-2-721
Dissipation factor (100 Hz)
150
E-4
IEC 62631-2-1
Dissipation factor (1 MHz)
280
E-4
IEC 62631-2-1
Dissipation factor (1GHz)
140
E-4
IEC 61189-2-721
Dissipation factor (10GHz)
120
E-4
IEC 61189-2-721
Volume resistivity
>1E13
Ohm*m
IEC 62631-3-1
Surface resistivity
Ohm
IEC 62631-3-2
Electric strength
43
kV/mm
IEC 60243-1
Comparative tracking index
600
V
IEC 60112
Other properties
Water absorption
5.1
%
Sim. to ISO 62
Water absorption in water at 23°C after 24h
0.4
%
ISO 62
Humidity absorption
2
%
Sim. to ISO 62
Density
1430
kg/m³
ISO 1183
JSON SPT
Molding shrinkage (parallel)
0.4
%
ISO 294-4
Molding shrinkage (normal)
1.2
%
ISO 294-4
Diagrams
Applications
Automotive Reflow Connectors
Industry
Automotive
- •} Reliable
- •} High temperature resistant
- •} High melting point
- •} Cost effective
- •} High co-planarity
- •} Low warpage after soldering
- •} High mechanical performance
- •} High flowability enables thin wall designs
Car computer control system
Industry
Automotive
Material
Application requirements
Superior mechanical and electrical performance
Dedicated color portfolio
High mechanical strength
No blistering
Material properties
CTI 600V, RTI 140°C
Halogen-free and free of ionic heat stabilizers
HB and UL94 V0 option
High mechanical strength}
Fakra connectors
Industry
Automotive
- •} Reflow soldering
- •} High weldline strength vs other PPAs
- •} Broad color portfolio
- •} For JTX8 solid JEDEC1 performance
- •} High material flow
