Akulon® K222-KMV5

25% Mineral Reinforced, Heat Stabilized, Flame Retardant (halogen free)

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General Information

Akulon® is our family of high performance polyamide 6 and polyamide 66 materials, used by customers across the world in applications ranging from automotive, electronics & electrical, to furniture and packaging.
We offer Akulon® grades for injection molding, blow molding and extrusion (including barrier film, stock shapes, convoluted tubes, and mono and multi filament).
In molded parts the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile for extrusion the strength, resilience and easy processing of Akulon® sets the market standards.
Special features
  • Heat stabilized
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-06-27
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2024-09-04
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Compliance Statement EU Sanctions and Embargos2024-05-16
  • Conflict minerals declaration (EICC, GeSI)2024-05-15
  • Deforestation Statement, Regulation (EU) 2023/1115 (EUDR)2024-09-19
  • Packaging Declaration EU Decision 97/129/EC (labelling)2024-04-17
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-11-08
Yellow Card
Processing technology
Injection Molding
Design challenge
Flame Retardancy | Halogen free
Applications
Have a question? Contact us

Rheological properties

Melt volume-flow rate
20
cm³/10min
Temperature
250
°C
Load
2.16
kg
Molding shrinkage (parallel)
0.91
%
Molding shrinkage (normal)
0.82
%

Mechanical properties

Tensile modulus
6500
MPa
Stress at break
70
MPa
Strain at break
2.5
%
Flexural modulus
6700
MPa
Flexural strength
110
MPa
Charpy impact strength (+23°C)
29
kJ/m²
Charpy impact strength (-30°C)
35
kJ/m²
Charpy notched impact strength (+23°C)
2
kJ/m²
Charpy notched impact strength (-30°C)
2
kJ/m²

Thermal properties

Melting temperature (10°C/min)
220
°C
Temp. of deflection under load (1.80 MPa)
110
°C
Temp. of deflection under load (0.45 MPa)
205
°C
Coeff. of linear therm. expansion (parallel)
0.5
E-4/°C
Coeff. of linear therm. expansion (normal)
0.5
E-4/°C
Burning Behav. at 0.75 mm nom. thickn.
V-2
class
Thickness tested
0.75
mm
Burning Behav. at 1.5 mm nom. thickn.
V-2
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-2
class
Thickness tested
3
mm
UL recognition
Yes
-
Ball pressure temperature
210
°C
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
0.75
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
3
mm
Glow Wire Ignition Temperature GWIT
700
°C
GWIT (Thickness (1) tested)
0.75
mm
Glow Wire Ignition Temperature GWIT
725
°C
GWIT (Thickness (2) tested)
3
mm

Electrical properties

Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Comparative tracking index
V

Other properties

Water absorption
6.2
%
Humidity absorption
1.8
%
Density
1380
kg/m³

Rheological calculation properties

Density of melt
1170
kg/m³
Thermal conductivity of melt
0.201
W/(m K)
Spec. heat capacity melt
2250
J/(kg K)
Eff. thermal diffusivity
7.63E-8
m²/s

JSON SPT

Melt volume-flow rate
20
cm³/10min
Temperature
250
°C
Load
2.16
kg
Molding shrinkage (parallel)
0.91
%
Molding shrinkage (normal)
0.82
%

Diagrams

Applications

Miniature Circuit Breakers

Industry
Electrical
Material
  • •} Halogen-free
  • •} Flame retardant
  • •} Heat-stabilized
  • •} Strength and resilience
  • •} Easy processing
}
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Molded case circuit breakers

Industry
Electrical
Material
Most grades are available with halogenfree flameretardancy, and in specific electro-grey colour for housings.}
More information