<ul> <li style='padding-left: 0.75em;text-indent: -0.75em;'>&#8226; ForTii® PA4T allows for reliable solutions due to its high melting temperature (ideal for reflow process), high mechanical performance (also after reflow soldering), a high dimensional stability (result from low, isotropic CLTE), a high co-planarity and low warpage after soldering, and good dielectrics due to low moisture uptake</li> <li style='padding-left: 0.75em;text-indent: -0.75em;'>&#8226; ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs</li> <li style='padding-left: 0.75em;text-indent: -0.75em;'>&#8226; ForTii® PA4T allow for even more sustainable solutions with reduced environmental impact due to its lower carbon footprint as compared to alternative materials</li> </ul>

ForTii® F11

PPA-GF30 FR(40)