Benefits
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Reduced environmental impact due to lower carbon footprint
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Low warpage
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Low moisture absorption
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High melt temperature (325°C, 617°F)
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High glass transition temperature (125°C, 257°F)
Details
Stanyl® PA46 and ForTii® PA4T are reliable solutions for flexible printed circuit (FPC) connectors due to their high stiffness even at elevated lead-free reflow assembly temperatures with hot spots up to 300°C (572°F). ForTii offers a halogen-free alternative for ICT components that enables the latest interface technology with lower power consumption and provides higher efficiency and optimized performance.