Vorteile
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Reliable
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High temperature resistant
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High melting point
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Cost effective
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High co-planarity
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Low warpage after soldering
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High mechanical performance
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High flowability enables thin wall designs
Details
ForTii® PA4T is a reliable choice for applications such as automotive reflow connectors due to its high temperature resistance and melting temperature of 325º C. It is a cost-effective solution because of its high mechanical performance after reflow soldering and high dimensional stability. Offering low isotropic CTE leading to a high co-planarity and low warpage after soldering, ForTii® PA4T’s high mechanical performance leads to reduced reject rates during pin assembly, while its high flowability enables thinner wall designs.