ForTii® TX1

30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
Special features
Regulatory Affairs
Processing technology
Injection Molding
Automotive OEM
HYUNDAI KIA
OEM Specification
MS-941-03-(2022)

Rheological properties

Molding shrinkage (parallel)
0.35
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 800 bar
110
mm
Spiral flow length 1.0 mm 900 bar
120
mm
Spiral flow length 1.0 mm 1000 bar
130
mm

Mechanical properties

Tensile modulus
11500
MPa
Tensile modulus (120°C)
8000
MPa
Tensile modulus (160°C)
5000
MPa
Tensile modulus, low thickness
10700
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
150
MPa
Stress at break (120°C)
95
MPa
Stress at break (160°C)
65
MPa
Stress at break, at low thickness
155
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2
%
Strain at break (120°C)
2.5
%
Strain at break (160°C)
3.6
%
Strain at break, at low thickness
2.1
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
11000
MPa
Flexural strength
240
MPa
Charpy impact strength (+23°C)
47
kJ/m²
Charpy notched impact strength (+23°C)
7
kJ/m²
Weldline strength at thickness 2
60
MPa
Weldline strain at thickness 2
0.7
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Temp. of deflection under load (1.80 MPa)
305
°C
Temp. of deflection under load (0.45 MPa)
323
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.65
E-4/°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.35
E-4/°C
Thermal conductivity in plane
0.4
W/(m K)
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
Thickness tested
3
mm
UL recognition
Yes
-
Oxygen index
39
%
Ball pressure temperature
305
°C
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
3
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
0.75
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (1) tested)
3
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (2) tested)
0.75
mm
Relative Temperature Index - electrical
130
°C
RTI electrical (Thickness (1) tested)
0.75
mm
Relative Temperature Index - electrical
120
°C
RTI electrical (Thickness (2) tested)
0.35
mm
Relative Temperature Index - with impact
110
°C
RTI with impact (Thickness (1) tested)
0.75
mm
Relative Temperature Index - with impact
120
°C
RTI with impact (Thickness (2) tested)
1.5
mm
Relative Temperature Index - without impact
120
°C
RTI without impact (Thickness (1) tested)
0.75
mm
Relative Temperature Index - without impact
130
°C
RTI without impact (Thickness (2) tested)
1.5
mm

Electrical properties

Relative permittivity (100Hz)
4.2
-
Relative permittivity (1 MHz)
3.9
-
Relative permittivity (1GHz)
3.8
-
Dissipation factor (100 Hz)
64
E-4
Dissipation factor (1 MHz)
176
E-4
Dissipation factor (1GHz)
130
E-4
Electric strength
33
kV/mm
Comparative tracking index
600
V
Comparative Tracking Index (above 600V)
≥800V
V

Other properties

Water absorption
4.1
%
Water absorption in water at 23°C after 24h
0.3
%
Humidity absorption
1.6
%
Density
1460
kg/m³

Material specific properties

Viscosity number
86
cm³/g

Diagrams

Applications

Audio Jack Connectors

Industry
Electronics
  • •} Cost-effective
  • •} High flowability
  • •} Low moisture absorption
  • •} Flame retardant
}

Automotive Reflow Connectors

Industry
Automotive
  • •} Reliable
  • •} High temperature resistant
  • •} High melting point
  • •} Cost effective
  • •} High co-planarity
  • •} Low warpage after soldering
  • •} High mechanical performance
  • •} High flowability enables thin wall designs
}

DDR DIMM Connectors

Industry
Electronics
  • •} Sustainable solution due to good carbon footprint
  • •} Flame retardant
  • •} Halogen-free
  • •} Red-phosphorous free
}

Fakra connectors

Industry
Automotive
  • •} Reflow soldering
  • •} High weldline strength vs other PPAs
  • •} Broad color portfolio
  • •} For JTX8 solid JEDEC1 performance
  • •} High material flow
}

High voltage connector

Industry
Automotive
Application requirements Superior electrical performance Dedicated high voltage High mechanical strength Material properties CTI 600V, RTI 140°C Halogen-free UL94-V0 @ 0.75mm Superior processability}

Power Connectors

Industry
Electronics
Material
  • •} Good processability
  • •} High flowability
  • •} Enables thin-walled designs
  • •} Sustainable solution
  • •} Lower carbon footprint
}

Reflow connectors (3)

Industry
Electronics
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}